1. 500 million transistors fit between 100 microns squared
2. Speck of dust destroys circuits
3. totally clean environment
4. Dress in Bunny suits- over 40 steps to equip a suit.
5. Architect decides what features the chip will have
6. Logic designers decide how it can be accomplished
7. Mask designers create the final layout of transistors
8. the wafer factory/FAB fabrication facility is a 1000x cleaner than a surgical room.
9. Silicon ingot is derived from sand
10. Bunny suits are worn in the “clean room” in the FAB
11. Mask contains images of circuits
12. when mask is exposed to spec. light- it reacts with photosensitive layer- which then carves into the silicon.
13. Nowadays FABS are 10~15mX cleaner than a surgical room
14. Supersaturated solutions are used to create Silicon Ingots
15. The ingot is cut into wafers using a diamond-tipped saw.
16. 3-4 weeks in Best case scenario to create a wafer from design; usually 3~4 months.
17. Silicon exposed to oxygen forms glass: SiO2
18. 45 nm refers to how wide the gate of the transistor is.
19. ~20masks for a modern microprocessor
20. Success rates must be in the high 90′s in order for the chip to go into production.
21. The processors are separated from the wafer by cleaving them with pressure after scratching the edges.